Flexible substrate ultrasonic bonding application
There are advantages of ultrasonic bonding such as low resistance, short time, and room temperature joining!
We would like to introduce our "Flexible Substrate Ultrasonic Joining Applications." The advantages of ultrasonic joining include low resistance due to direct bonding, the ability to join in less than one second, and no thermal expansion of the substrate. Additionally, the joining variations can be done with bumped leads and flying leads. 【Features】 ■ Low resistance joining ■ Short joining time ■ Room temperature joining *For more details, please download the PDF or feel free to contact us.
- Company：アドウェルズ
- Price：Other
